Machine-readable view

Unisem Electronics

India

Description

Capabilities

  • Semiconductor assembly and test services
  • packaging of ICs in various package families (QFN
  • QFP
  • BGA
  • SIP
  • etc.)
  • test and burn‑in of ICs
  • outsourced semiconductor assembly and test (OSAT) for analog
  • mixed‑signal
  • power and RF devices
  • design support for packaging and test solutions

Certifications

    Industries served

    Aerospace & Defense

    Export markets

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