Capabilities
Distribution of automotive microcontrollers
SoCs and powertrain ICs
body
infotainment and ADAS semiconductors
analog
power and discrete devices
memory and storage
wireless connectivity and IoT modules
sensors (pressure
MEMS
position
etc.) and passives from Japanese and global semiconductor vendors
ECU reference designs and solution kits for telematics
instrument clusters
body control
ADAS and EV subsystems
hardware design and software support for customers
mass‑production logistics
VMI and supply‑chain solutions
technical support and localization as a semiconductor
Profile
Source from Toyota Tsusho Nexty Electronics
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