Machine-readable view

Te Connectivity

Japan

Description

Capabilities

  • Connectors (board‑to‑board
  • wire‑to‑board
  • wire‑to‑wire
  • I/O
  • high‑speed)
  • cable assemblies
  • terminals and splices
  • relays and contactors
  • antennas and RF components
  • fiber‑optic connectors and components
  • heat‑shrink tubing and wire protection
  • EMI/EMC shielding and filtering parts
  • sensors (position
  • pressure
  • temperature etc.)
  • identification and labeling products
  • application tooling (crimp tools
  • presses
  • applicators)
  • design and manufacture of interconnect
  • protection and sensor solutions for automotive
  • industrial
  • telecom
  • aerospace and data‑center markets

Certifications

    Industries served

    Semiconductor, Automotive, EV & Battery, Robotics & Automation, Construction & Infrastructure, Consumer Electronics, Telecommunications, Aerospace & Defense, Space

    Export markets

    Source from Te Connectivity. Upload your BOM and Lexa will match you to the right suppliers.

    Open Lexa →