Capabilities
Rigid PCB (FR4
High-Tg)
SMT (Surface Mount)
THT (Through-Hole)
Mixed Assembly
Potting / Encapsulation
manufacture of semiconductor chips targeting power electronics
analog ICs and industrial systems
back‑end semiconductor manufacturing including assembly
packaging and test for applications in automotive
Profile
Certifications
ISO 9001 CertifiedISO 14001ISO 45001
Source from Suchi Semicon Pvt Ltd
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