Capabilities
Rigid PCB (FR4
High-Tg)
SMT (Surface Mount)
THT (Through-Hole)
Mixed Assembly
Potting / Encapsulation
manufacture of semiconductor chips targeting power electronics
analog ICs and industrial systems
back‑end semiconductor manufacturing including assembly
packaging and test for applications in automotive
Profile
Source from Suchi Semicon Pvt Ltd
Let Lexa handle the RFQ. Upload your BOM and we'll match you to the right suppliers.